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AM29BL802C120RZE 参数 Datasheet PDF下载

AM29BL802C120RZE图片预览
型号: AM29BL802C120RZE
PDF下载: 下载PDF文件 查看货源
内容描述: 8兆位( 512K的x 16位) CMOS 3.0伏只突发模式闪存 [8 Megabit (512 K x 16-Bit) CMOS 3.0 Volt-only Burst Mode Flash Memory]
分类和应用: 闪存
文件页数/大小: 46 页 / 772 K
品牌: SPANSION [ SPANSION ]
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D A T A S H E E T  
outputs are placed in the high impedance state, inde-  
IND# End of Burst Indicator  
pendent of the OE# input.  
The IND# output signal goes low when the device is  
ouputting the last word of a 32-word burst sequence  
(word Da+31). When the starting address was loaded  
with LBA#, the 5-bit burst address counter was set to  
00000b. The counter increments to 11111b on the  
32nd word in the burst sequence. If the system con-  
tinues to assert BAA# low, on the next CLK the device  
will output the starting address data (Da). The burst  
address counter will be again set to 00000b, and will  
have “wrapped around.”  
The device enters the CMOS standby mode when the  
CE# and RESET# pins are both held at V ± 0.3 V.  
CC  
(Note that this is a more restricted voltage range than  
V .) If CE# and RESET# are held at V , but not within  
IH  
IH  
V
± 0.3 V, the device will be in the standby mode, but  
CC  
the standby current will be greater. The device requires  
standard access time (t ) for read access when the de-  
CE  
vice is in either of these standby modes, before it is  
ready to read data.  
If the device is deselected during erasure or program-  
ming, the device draws active current until the operation  
is completed.  
Writing Commands/Command Sequences  
To write a command or command sequence (which in-  
cludes programming data to the device and erasing sec-  
tors of memory), the system must drive WE# and CE# to  
In the DC Characteristics table, I  
and I  
represents  
CC3  
CC4  
the standby current specification.  
V , and OE# to V .  
IL  
IH  
The device features an Unlock Bypass mode to facili-  
tate faster programming. Once the device enters the Un-  
lock Bypass mode, only two write cycles are required to  
program a word, instead of four. The “Program Com-  
mand Sequence” section has details on programming  
data to the device using both standard and Unlock By-  
pass command sequences.  
Automatic Sleep Mode  
The automatic sleep mode minimizes Flash device  
energy consumption. The device automatically enables  
this mode when addresses remain stable for t  
+ 30  
ACC  
ns. The automatic sleep mode is independent of the  
CE#, WE#, and OE# control signals. Standard address  
access timings provide new data when addresses are  
changed. While in sleep mode, output data is latched  
and always available to the system. I  
Characteristics table represents the automatic sleep  
mode current specification.  
An erase operation can erase one sector, multiple sec-  
tors, or the entire device. Table 2 indicates the address  
space that each sector occupies. A “sector address”  
consists of the address bits required to uniquely select a  
sector. The “Command Definitions” section has details  
on erasing a sector or the entire chip, or suspending/re-  
suming the erase operation.  
in the DC  
CC4  
RESET#: Hardware Reset Pin  
The RESET# pin provides a hardware method of reset-  
ting the device to reading array data. When the system  
drives the RESET# pin to V for at least a period of t ,  
After the system writes the autoselect command se-  
quence, the device enters the autoselect mode. The sys-  
tem can then read autoselect codes from the internal  
register (which is separate from the memory array) on  
DQ7–DQ0. Standard read cycle timings apply in this  
mode. Refer to the “Autoselect Mode” and “Autoselect  
Command Sequence” sections for more information.  
IL  
RP  
the device immediately terminates any operation in  
progress, tristates all data output pins, and ignores all  
read/write attempts for the duration of the RESET#  
pulse. The device also resets the internal state machine  
to reading array data. The operation that was interrupted  
should be reinitiated once the device is ready to accept  
another command sequence, to ensure data integrity.  
I
in the DC Characteristics table represents the ac-  
CC2  
tive current specification for the write mode. The “AC  
Characteristics” section contains timing specification ta-  
bles and timing diagrams for write operations.  
Current is reduced for the duration of the RESET#  
pulse. When RESET# is held at V  
draws CMOS standby current (I  
0.3 V, the device  
). If RESET# is held  
SS  
CC4  
at V but not within V  
be greater.  
0.3 V, the standby current will  
Program and Erase Operation Status  
During an erase or program operation, the system may  
check the status of the operation by reading the status  
IL  
SS  
The RESET# pin may be tied to the system reset cir-  
cuitry. A system reset would thus also reset the Flash  
memory, enabling the system to read the boot-up firm-  
ware from the Flash memory.  
bits on DQ7–DQ0. Standard read cycle timings and I  
CC  
read specifications apply. Refer to “Write Operation Sta-  
tus” for more information, and to “AC Characteristics” for  
timing diagrams.  
If RESET# is asserted during a program or erase oper-  
ation, the RY/BY# pin remains a “0” (busy) until the inter-  
nal reset operation is complete, which requires a time of  
Standby Mode  
When the system is not reading or writing to the device,  
it can place the device in the standby mode. In this  
mode, current consumption is greatly reduced, and the  
t
(during Embedded Algorithms). The system can  
READY  
thus monitor RY/BY# to determine whether the reset op-  
eration is complete. If RESET# is asserted when a pro-  
10  
Am29BL802C  
22371C7 November 3, 2006