S U P P L E M E N T
REVISION SUMMARY
Revision A (June 7, 2000)
Initial release.
Revision A+2 (September 11, 2002)
Changed title from Boot Sector Flash to Burst-mode,
Boot Sector Flash.
Revision A+1 (December 19, 2000)
Product Selector Guide
Corrected reference to BL162C data sheet publication
number.
Removed Note #2.
AC Characteristics
Ordering Information
Added Read Operations, Burst Mode Read, and Erase/
Program Operations and Alternate CE# Controlled
Erase/Program Operations Tables.
Added quantities for Waffle Pack, Gel-Pak, and Sur-
ftape.
Revision A+2 (September 11, 2002)
Revision A + 3 (April 29, 2003)
Product Test Flow
Moved Pad 11 on Die Pad Locations Diagram
Added Pad 52 to Pad Description Tables (Relative to
Pad 1 and Relative to Die Center)
Replaced text preceding Figure 1.
Trademarks
Copyright © 2003 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
18
Am29BL162C Known Good Die
SPANSION [ SPANSION ]
