S U P P L E M E N T
PHYSICAL SPECIFICATIONS
MANUFACTURING INFORMATION
Die dimensions . . . . . . . . . . 269.7 mils x 303.94 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . 6.85 mm x 7.72 mm
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . FASL
Wafer Sort Test . . . . . . . . . . . Sunnyvale, CA, USA &
. . . . . . . . . . . . . . . . . . . . . . . . . . . . Penang, Malaysia
Die Thickness . . . . . . . . . . . . . . . . . . . . . . . . .500 µm
Bond Pad Size . . . . . . . . . . . . . . . 4.69 mils x 4.69mils
. . . . . . . . . . . . . . . . . . . . . . . . . . 115.9 µm x 115.9 µm
Manufacturing ID (Bottom Boot) . . . . . . . . .98849ABK
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . CS39LS
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pad Area Free of Passivation . . . . . . . . . .13.99 mils2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9,025 µm2
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Bond Pad Metalization . . . . . . . . . . . . . . . . . . . . Al/Cu
SPECIAL HANDLING INSTRUCTIONS
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
may be grounded (optional)
Processing
Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250°C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
DC OPERATING CONDITIONS
VCC (Supply Voltage) . . . . . . . . . . . . . . .3.0 V to 3.6 V
Operating Temperature
Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended . . . . . . . . . . . . . . . . . . –55°C to +125°C
Super Extended. . . . . . . . . . . . . –55°C to +145°C
Storage
Store at a maximum temperature of 30°C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
DC PARAMETER EXCEPTIONS
The following specifications replace those given in the Am29BL162 data sheet (publication number 22142):
Parameter
Description
Test Conditions
Typ
Max
Unit
ICC3
VCC Standby Current (Note 2)
CE#, RESET# = VCC±0.3 V
22
35
µA
VCC Standby Current During Reset
(Note 2)
ICC4
RESET# = VSS ± 0.3 V
22
35
µA
OE# = VIH
OE# = VIL
30
30
50
50
µA
µA
Automatic Sleep Mode
(Notes 2, 3)
VIH = VCC ± 0.3 V;
IL = VSS ± 0.3 V
ICC5
V
Notes:
2. Maximum ICC specifications are tested with VCC = VCCmax.
3. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30 ns.
Am29BL162C Known Good Die
15
SPANSION [ SPANSION ]
