A D V A N C E
I N F O R M A T I O N
CONNECTION DIAGRAM
80-ball Fine-Pitch Ball Grid Array
(Top View, Balls Facing Down)
A8
NC
A7
NC
B8
NC
B7
NC
C8
NC
C7
A13
C6
A9
C5
WE#
C4
RDY
C3
A7
D8
NC
D7
A12
D6
A8
D5
RESET#
D4
ACC
D3
A17
D2
A4
D1
V
CC
E8
NC
E7
A14
E6
A10
E5
A21
E4
A18
E3
A6
E2
A2
E1
CLK
F8
V
IO
F7
A15
F6
A11
F5
A19
F4
A20
F3
A5
F2
A1
F1
WP#
G8
V
SSIO
G7
A16
G6
DQ7
G5
DQ5
G4
DQ2
G3
DQ0
G2
A0
G1
AVD#
H8
NC
H7
NC
H6
DQ14
H5
DQ12
H4
DQ10
H3
DQ8
H2
CE#
H1
V
IO
J8
NC
J7
DQ15
J6
DQ13
J5
V
CC
J4
DQ11
J3
DQ9
J2
OE#
J1
V
SSIO
K8
NC
K7
V
SS
K6
DQ6
K5
DQ4
K4
DQ3
K3
DQ1
K2
V
SS
K1
NC
L8
NC
L7
NC
M8
NC
M7
NC
A2
NC
A1
NC
B2
NC
B1
NC
C2
A3
C1
NC
L2
NC
L1
NC
M2
NC
M1
NC
Special Handling Instructions for FBGA
Package
Special handling is required for Flash Memory products
in FBGA packages.
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compro-
mised if the package body is exposed to temperatures
above 150°C for prolonged periods of time.
8
Am29BDS640G
October 31, 2002
SPANSION [ SPANSION ]
