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AM29BDS640GT93WSF 参数 Datasheet PDF下载

AM29BDS640GT93WSF图片预览
型号: AM29BDS640GT93WSF
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash, 4MX16, 20ns, PBGA80, 11 X 12 MM, FBGA-80]
分类和应用: 内存集成电路
文件页数/大小: 62 页 / 863 K
品牌: SPANSION [ SPANSION ]
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A D V A N C E I N F O R M A T I O N  
GENERAL DESCRIPTION  
The Am29BDS640G is a 64 Mbit, 1.8 Volt-only, simulta-  
neous Read/Write, Burst Mode Flash memory device, orga-  
nized as 4,194,304 words of 16 bits each. This device uses  
a single VCC of 1.65 to 1.95 V to read, program, and erase  
the memory array. The device supports Enhanced VIO to  
offer up to 3V compatible inputs and outputs. A 12.0-volt VID  
may be used for faster program performance if desired. The  
device can also be programmed in standard EPROM pro-  
grammers.  
The clock polarity feature provides system designers a  
choice of active clock edges, either rising or falling. The ac-  
tive clock edge initiates burst accesses and determines  
when data will be output.  
The device is entirely command set compatible with the  
JEDEC 42.4 single-power-supply Flash standard. Com-  
mands are written to the command register using standard  
microprocessor write timing. Register contents serve as in-  
puts to an internal state-machine that controls the erase and  
programming circuitry. Write cycles also internally latch ad-  
dresses and data needed for the programming and erase  
operations. Reading data out of the device is similar to read-  
ing from other Flash or EPROM devices.  
At 54 MHz, the device provides a burst access of 13.5 ns at  
30 pF with a latency of 87.5 ns at 30 pF. At 40 MHz, the de-  
vice provides a burst access of 20 ns at 30 pF with a latency  
of 95 ns at 30 pF. The device operates within the industrial  
temperature range of -40°C to +85°C. The device is offered  
in the 80-ball FBGA package.  
The Erase Suspend/Erase Resume feature enables the  
user to put erase on hold for any period of time to read data  
from, or program data to, any sector that is not selected for  
erasure. True background erase can thus be achieved.  
The Simultaneous Read/Write architecture provides simul-  
taneous operation by dividing the memory space into four  
banks. The device can improve overall system performance  
by allowing a host system to program or erase in one bank,  
then immediately and simultaneously read from another  
bank, with zero latency. This releases the system from wait-  
ing for the completion of program or erase operations.  
The hardware RESET# pin terminates any operation in  
progress and resets the internal state machine to reading  
array data. The RESET# pin may be tied to the system reset  
circuitry. A system reset would thus also reset the device,  
enabling the system microprocessor to read boot-up firm-  
ware from the Flash memory device.  
The device is divided as shown in the following table:  
The host system can detect whether a program or erase op-  
eration is complete by using the device status bit DQ7  
(Data# Polling) and DQ6/DQ2 (toggle bits). After a program  
or erase cycle has been completed, the device automatically  
returns to reading array data.  
Bank  
Quantity  
Size  
4
8 Kwords  
32 Kwords  
32 Kwords  
32 Kwords  
32 Kwords  
8 Kwords  
A
31  
32  
32  
31  
4
B
C
The sector erase architecture allows memory sectors to be  
erased and reprogrammed without affecting the data con-  
tents of other sectors. The device is fully erased when  
shipped from the factory.  
D
Hardware data protection measures include a low VCC de-  
tector that automatically inhibits write operations during  
power transitions. The device also offers two types of data  
protection at the sector level. The sector lock/unlock com-  
mand sequence disables or re-enables both program and  
erase operations in any sector. When at VIL, WP# locks sec-  
tors 0 and 1 (bottom boot device) or sectors 132 and 133  
(top boot device).  
The Enhanced VersatileIO™ (VIO) control allows the host  
system to set the voltage levels that the device generates at  
its data outputs and the voltages tolerated at its data inputs  
to the same voltage level that is asserted on the VIO pin.  
This allows the device to operate in 1.8 V and 3 V system  
environments as required.  
The device offers two power-saving features. When ad-  
dresses have been stable for a specified amount of time, the  
device enters the automatic sleep mode. The system can  
also place the device into the standby mode. Power con-  
sumption is greatly reduced in both modes.  
The device uses Chip Enable (CE#), Write Enable (WE#),  
Address Valid (AVD#) and Output Enable (OE#) to control  
asynchronous read and write operations. For burst opera-  
tions, the device additionally requires Ready (RDY), and  
Clock (CLK). This implementation allows easy interface with  
minimal glue logic to a wide range of microprocessors/micro-  
controllers for high performance read operations.  
AMD’s Flash technology combines years of Flash memory  
manufacturing experience to produce the highest levels of  
quality, reliability and cost effectiveness. The device electri-  
cally erases all bits within a sector simultaneously via  
Fowler-Nordheim tunnelling. The data is programmed using  
hot electron injection.  
The burst read mode feature gives system designers flexibil-  
ity in the interface to the device. The user can preset the  
burst length and wrap through the same memory space, or  
read the flash array in continuous mode.  
2
Am29BDS640G  
May 9, 2002  
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