P r e l i m i n a r y
Connection Diagram
64-ball Fine-Pitch Ball Grid Array
(Top View, Balls Facing Down)
A8
NC
B8
NC
C8
NC
D8
E8
F8
G8
NC
H8
NC
VIO
VSS
NC
A7
B7
C7
D7
E7
F7
G7
H7
VSS
A13
A12
A14
A15
A16
NC
DQ15
A6
A9
B6
A8
C6
D6
E6
F6
G6
H6
A10
A11
DQ7
DQ14
DQ13
DQ6
A5
B5
C5
NC
D5
E5
F5
G5
H5
VCC
WE# RESET#
A19
DQ5
DQ12
DQ4
A4
B4
C4
D4
E4
F4
G4
H4
RDY
ACC
A18
A20
DQ2
DQ10
DQ11
DQ3
A3
A7
B3
C3
A6
D3
A5
E3
F3
G3
H3
A17
DQ0
DQ8
DQ9
DQ1
A2
A3
B2
A4
C2
A2
D2
A1
E2
A0
F2
G2
H2
VSS
CE#
OE#
G1
A1
NC
B1
C1
D1
E1
F1
H1
NC
VCC
CLK
WP#
AVD#
VIO
VSS
Special Handling Instructions for FBGA Package
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultra-
sonic cleaning methods. The package and/or data integrity may be compromised
if the package body is exposed to temperatures above 150°C for prolonged peri-
ods of time.
October 1, 2003 27243B1
Am29BDS320G
9