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AM29BDS128HE9VMI 参数 Datasheet PDF下载

AM29BDS128HE9VMI图片预览
型号: AM29BDS128HE9VMI
PDF下载: 下载PDF文件 查看货源
内容描述: 128或64兆比特( 8 M或4米×16位) CMOS 1.8伏只同步读/写,突发模式闪存 [128 or 64 Megabit (8 M or 4 M x 16-Bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst Mode Flash Memory]
分类和应用: 闪存
文件页数/大小: 89 页 / 1587 K
品牌: SPANSION [ SPANSION ]
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DATA SHEET
Am29BDS128H/Am29BDS640H
128 or 64 Megabit (8 M or 4 M x 16-Bit)
CMOS 1.8 Volt-only Simultaneous Read/Write, Burst Mode Flash Memory
The Am29BDS640H has been retired and is not recommended for designs. For new designs, S29WS064K supersedes Am29BDS640H. Please refer to the S29WS-K family data sheet for
specifications and ordering information. The Am29BDS128H is available and is not affected by this revision.
DISTINCTIVE CHARACTERISTICS
ARCHITECTURAL ADVANTAGES
Single 1.8 volt read, program and erase (1.65 to 1.95 volt)
Manufactured on 0.13 µm process technology
VersatileIO™ (V
IO
) Feature
— Device generates data output voltages and tolerates data
input voltages as determined by the voltage on the V
IO
pin
— 1.8V compatible I/O signals
Simultaneous Read/Write operation
— Data can be continuously read from one bank while
executing erase/program functions in other bank
— Zero latency between read and write operations
— Four bank architecture:
128 Mb has 16/48/48/16 Mbit banks
64 Mb has 8/24/24/8 Mbit banks
Programable Burst Interface
— 2 Modes of Burst Read Operation
— Linear Burst: 8, 16, and 32 words with wrap-around
— Continuous Sequential Burst
SecSi
TM
(Secured Silicon) Sector region
— Up to 128 words accessible through a command sequence
— Up to 64 factory-locked words
— Up to 64 customer-lockable words
Sector Architecture
— Banks A and D each contain both 4 Kword sectors and 32
Kword sectors; Banks B and C contain ninety-six 32 Kword
sectors
— Sixteen 4 Kword boot sectors
Half of the boot sectors are at the top of the address range;
half are at the bottom of address range
Minimum 1 million erase cycle guarantee per sector
20-year data retention at 125°C
— Reliable operation for the life of the system
80-ball FBGA package (128 Mb) or 64-ball FBGA (64 Mb)
package
HARDWARE FEATURES
Handshaking feature
— Provides host system with minimum possible latency by
monitoring RDY
— Reduced Wait-state handshaking option further reduces
initial access cycles required for burst accesses beginning on
even addresses
Hardware reset input (RESET#)
— Hardware method to reset the device for reading array data
WP# input
— Write protect (WP#) function allows protection of the four
highest and four lowest 4 kWord boot sectors, regardless of
sector protect status
Persistent Sector Protection
— A command sector protection method to lock combinations of
individual sectors and sector groups to prevent program or
erase operations within that sector
— Sectors can be locked and unlocked in-system at V
CC
level
Password Sector Protection
— A sophisticated sector protection method to lock
combinations of individual sectors and sector groups to
prevent program or erase operations within that sector using
a user-defined 64-bit password
ACC input: Acceleration function reduces programming
time; all sectors locked when ACC = V
IL
CMOS compatible inputs, CMOS compatible outputs
Low V
CC
write inhibit
SOFTWARE FEATURES
Supports Common Flash Memory Interface (CFI)
Software command set compatible with JEDEC 42.4
standards
— Backwards compatible with Am29F and Am29LV families
Data# Polling and toggle bits
— Provides a software method of detecting program and erase
operation completion
Erase Suspend/Resume
— Suspends an erase operation to read data from, or program
data to, a sector that is not being erased, then resumes the
erase operation
Unlock Bypass Program command
— Reduces overall programming time when issuing multiple
program command sequences
Burst Suspend/Resume
— Suspends a burst operation to allow system use of the
address and data bus, than resumes the burst at the previous
state
Publication#
27024
Rev:
B
Amendment:
3
Issue Date:
May 10, 2006
PERFORMANCE CHARCTERISTICS
Read access times at 75/66/54 MHz (C
L
=30 pF)
— Burst access times of 9.3/11/13.5 ns at industrial
temperature range
— Synchronous latency of 49/56/69 ns
— Asynchronous random access times of 45/50/55 ns
Power dissipation (typical values, C
L
= 30 pF)
— Burst Mode Read: 10 mA
— Simultaneous Operation: 25 mA
— Program/Erase: 15 mA
— Standby mode: 0.2 µA