D A T A S H E E T
ORDERING INFORMATION
The order number (Valid Combination) is formed by the following:
Am29BDS 128 VK
H
E
8
I
TEMPERATURE RANGE
Industrial (–40°C to +85°C)
I
=
PACKAGE TYPE
VK = 80-Ball Fine-Pitch Ball Grid Array (BGA)
0.80 mm pitch, 11.5 x 9 mm package (VBB080)
VF = 80-Ball Fine-Pitch Ball Grid Array (BGA)
0.80 mm pitch, 11.5 x 9mm, Pb-free Package (VBB080)
VM = 64-Ball Fine-Pitch Ball Grid Array (BGA)
0.80 mm pitch, 8 X 9 mm package (VBD064)
V
8
9
AND HANDSHAKING OPTIONS
IO
=
=
VIO = 1.8 V, reduced wait-state handshaking enabled
VIO = 1.8 V, standard handshaking
SPEED
E
D
=
=
66 MHz
54 MHz
PROCESS TECHNOLOGY
0.13 µm
H
=
DENSITY
128 = 128 Mbit (8 M x 16-bit)
64 64 Mbit (4 M x 16-bit)
=
DEVICE FAMILY
Am29BDS
CMOS Flash Memory, Simultaneous Read/Write,
Burst Mode Flash Memory, 1.8 Volt-only Read, Program, and Erase
Valid Combinations
Burst Frequency
Order Number
Package Marking
BS128HE8V
BS128HE9V
BS128HD8V
BS128HD9V
BS128HE8VF
BS128HE9VF
BS128HD8VF
BS128HD9VF
BS640HE8V
BS640HE9V
BS640HD8V
BS640HD9V
(MHz)
Density
Am29BDS128HE8
Am29BDS128HE9
Am29BDS128HD8
Am29BDS128HD9
Am29BDS128HE8
Am29BDS128HE9
Am29BDS128HD8
Am29BDS128HD9
Am29BDS640HE8
Am29BDS640HE9
Am29BDS640HD8
Am29BDS640HD9
66
VKI
VFI
VMI
54
66
54
66
54
128 Mbit
64 Mbit
Valid Combinations
Valid Combinations list configurations planned to be supported in vol-
ume for this device. Consult the local AMD sales office to confirm avail-
ability of specific valid combinations and to check on newly released
combinations.
10
Am29BDS128H/Am29BDS640H
27024B3 May 10, 2006
SPANSION [ SPANSION ]
