S U P P L E M E N T
PRODUCT TEST FLOW
Figure 1 provides an overview of AMD’s Known Good
Die test flow. For more detailed information, refer to the
Am29BDD160G product qualification database. AMD
implements quality assurance procedures throughout
the product test flow. These QA procedures also allow
AMD to produce KGD products without requiring or
implementing burn-in. In addition, an off-line quality
monitoring program (QMP) further guarantees AMD
quality standards are met on Known Good Die prod-
ucts.
DC Parameters
Functionality
Programmability
Erasability
Wafer Sort 1
Data Retention
Bake
24 hours at 250°C
DC Parameters
Functionality
Programmability
Erasability
Wafer Sort 2
DC Parameters
Functionality
Programmability
Erasability
Wafer Sort 3
High Temperature
Speed
Incoming Inspection
Wafer Saw
Die Separation
100% Visual Inspection
Die Pack
Packaging for Shipment
Shipment
Figure 1. AMD KGD Product Test Flow
Am29BDD160G Known Good Die—Die Revision 1
11
SPANSION [ SPANSION ]
