D A T A S H E E T
REVISION SUMMARY
Physical Dimensions
Revision A (January 1998)
Replaced figures with more detailed illustrations. The
FBGA package OPN designation is now FBA048.
First release.
Revision B (July 1998)
Expanded data sheet from Advanced Information to
Preliminary version.
Revision D+1 (November 8, 2000)
Global
Added table of contents. Deleted burn-in option from
Ordering Information section.
Distinctive Characteristics
Changed “Manufactured on 0.35 µm process technol-
ogy” to “Manufactured on 0.32 µm process technology”.
Revision D+2 (October 30, 2003)
Package Options
General Description
Second paragraph: Changed “This device is manufac-
tured using AMD’s 0.35 µm process technology” to
“This device is manufactured using AMD’s 0.32 µm
process technology”.
Added Lead (Pb) - Free Packaging Available option.
Special Handling Instructions for Fine Pitch Ball
Grid Array (FBGA)
Removed first sentence of second paragraph.
Revision B+1 (August 1998)
Global
Standard Products - Temperature Range
Added new D, F, and K temperature ranges, and in-
cluded this new information in the valid combinations
for TSOP, SO, and FBGA Packages
Added the 55 ns speed option.
Connection Diagrams
DC Characteristics - CMOS Compatible
Corrected the orientation identifiers on the reverse
TSOP package. Changed the FBGA drawing to top
view, balls facing down.
Added ILR.
AC Characteristics - Read Operations
Revision C (January 1999)
Global
Modified speed options for tEHQZ and tGHQZ
.
AC Characteristics - Word/Byte Configuration
(BYTE#)
Added -50R speed option.
Modified speed options for tFLQZ.
Ordering Information
BGA Capacitance
Valid Combinations: Deleted the Am29LV400BT80
and Am29LV400BB80 entries.
Added new table with specified information.
Erase and Programming Performance
Trademarks
Note 2: Changed “(3.0 V for 55R)’ to “(3.0 V for regu-
lated speed options)”.
Updated.
Revision D+3 (December 13, 2005)
Global
Revision C+1 (July 2, 1999)
Global
This product has been retired and is not available for
designs. For new and current designs, S29AL004D
supersedes Am29LV400B and is the factory-recom-
mended migration path. Please refer to the
S29AL004D data sheet for specifications and ordering
information. Availability of this document is retained for
reference and historical purposes only.
Deleted references to the 50R speed option.
Revision D (January 3, 1999)
AC Characteristics—Figure 17. Program
Operations Timing and Figure 18. Chip/Sector
Erase Operations
Deleted tGHWL and changed OE# waveform to start at
high.
Revision D4 (December 4, 2006)
AC Characteristics
Erase/Program Operations table: Changed tBUSY to a
maximum specification.
December 4, 2006 21523D4
Am29LV400B
45
SPANSION [ SPANSION ]
