D A T A
S H E E T
The package and/or data integrity may be compro-
mised if the package body is exposed to temperatures
above 150°C for prolonged periods of time.
Special Handling Instructions for (FBGA)
Special handling is required for Flash Memory prod-
ucts in FBGA packages.
PIN CONFIGURATION
A0–A17
=18 addresses
DQ0–DQ14 =15 data inputs/outputs
DQ15/A-1
BYTE#
CE#
OE#
WE#
RESET#
RY/BY#
V
CC
=DQ15 (data input/output, word mode),
A-1 (LSB address input, byte mode)
=Selects 8-bit or 16-bit mode
=Chip enable
=Output enable
=Write enable
=Hardware reset pin, active low
=Ready/Busy# output
=3.0 volt-only single power supply
(see Product Selector Guide for speed
options and voltage supply tolerances)
=Device ground
=Pin not connected internally
LOGIC SYMBOL
18
A0–A17
DQ0–DQ15
(A-1)
CE#
OE#
WE#
RESET#
BYTE#
RY/BY#
16 or 8
V
SS
NC
December 4, 2006 21523D4
Am29LV400B
7
SPANSION [ SPANSION ]
