CXA3201N
Package Outline
Unit: mm
16PIN SSOP (PLASTIC)
+ 0.2
1.25 – 0.1
5.0 ± 0.1
0.1
9
16
A
8
1
+ 0.05
0.15 – 0.02
0.65
+ 0.1
0.22 – 0.05
0.13
M
0.1 ± 0.1
0° to 10°
DETAIL A
NOTE: Dimension “ ” does not include mold protrusion.
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER / PALLADIUM
PLATING
SONY CODE
EIAJ CODE
SSOP-16P-L01
SSOP016-P-0044
42/COPPER ALLOY
0.1g
JEDEC CODE
PACKAGE MASS
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
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