CXA3185/3186N
Package Outline Unit : mm
30PIN SSOP (PLASTIC)
+ 0.2
1.25 – 0.1
9.7 ± 0.1
0.10
30
16
A
1
15
+ 0.1
0.22 – 0.05
+ 0.05
– 0.02
0.65
0.15
0.13
M
0.1 ± 0.1
0° to 10°
NOTE: Dimension “ ” does not include mold protrusion.
DETAIL A
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SOLDER/PALLADIUM
PLATING
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
SONY CODE
EIAJ CODE
SSOP-30P-L01
42/COPPER ALLOY
SSOP030-P-0056
JEDEC CODE
0.1g
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
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