CXA2500M/N
Package Outline
Unit: mm
24PIN SOP (PLASTIC)
CXA2500M
+ 0.4
15.0 – 0.1
+ 0.4
1.85 – 0.15
24
13
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
12
+ 0.1
0.2 – 0.05
1.27
± 0.12
M
PACKAGE STRUCTURE
MOLDING COMPOUND
EPOXY/PHENOL RESIN
SOLDER PLATING
COPPER ALLOY / 42ALLOY
0.3g
LEAD TREATMENT
LEAD MATERIAL
SONY CODE
EIAJ CODE
SOP-24P-L01
SOP024-P-0300-A
JEDEC CODE
PACKAGE WEIGHT
CXA2500N
24PIN SSOP(PLASTIC)
+ 0.2
1.25 – 0.1
7.8 ± 0.1
0.1
24
13
A
1
b
12
0.13
M
0.65
B
+ 0.1
b=0.22 – 0.05
(0.22)
b=0.22 ± 0.03
0.1 ± 0.1
DETAIL B : SOLDER
DETAIL B : PALLADIUM
0° to 10°
NOTE: Dimension “ ” does not include mold protrusion.
DETAIL
A
PACKAGE STRUCTURE
EPOXY RESIN
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
SOLDER/PALLADIUM
SONY CODE
EIAJ CODE
SSOP-24P-L01
SSOP024-P-0056
PLATING
42/COPPER ALLOY
0.1g
JEDEC CODE
PACKAGE MASS
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
– 11 –
SONY [ SONY CORPORATION ]
