CXA2064M
Package Outline
Unit: mm
30PIN SOP(PLASTIC)
+ 0.4
2.3 – 0.15
+ 0.4
18.8 – 0.1
0.1
30
16
+ 0.2
0.1 – 0.05
A
15
1
+ 0.1
0.2 – 0.05
1.27
0.45 ± 0.1
0.2
M
0° to 10°
DETAIL A
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
EIAJ CODE
LEAD TREATMENT
LEAD MATERIAL
SOP-30P-L03
SOLDER PLATING
COPPER ALLOY
0.7g
SOP030-P-0375
JEDEC CODE
PACKAGE MASS
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
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