CXA1619AM/AS
Package Outline Unit : mm
CXA1619AM
28PIN SOP (PLASTIC)
+ 0.4
18.8 – 0.1
+ 0.4
2.3 – 0.15
28
15
0.15
+ 0.2
0.1 – 0.05
14
1
+ 0.1
0.2 – 0.05
1.27
0.45 ± 0.1
M
0.24
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER PLATING
42/COPPER ALLOY
0.7g
SONY CODE
EIAJ CODE
SOP-28P-L04
SOP028-P-0375
JEDEC CODE
PACKAGE MASS
30PIN SDIP (PLASTIC)
CXA1619AS
+ 0.4
26.9 – 0.1
30
16
0° to 15°
15
1
1.778
Two kinds of package surface:
1.All mat surface type.
2.All mirror surface type.
0.5 ± 0.1
0.9 ± 0.15
PACKAGE STRUCTURE
EPOXY RESIN
MOLDING COMPOUND
LEAD TREATMENT
LEAD MATERIAL
SOLDER/PALLADIUM
SONY CODE
EIAJ CODE
SDIP-30P-01
PLATING
COPPER ALLOY
1.8g
SDIP030-P-0400
JEDEC CODE
PACKAGE MASS
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
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SONY [ SONY CORPORATION ]
