CXA1560S, CXA1561M/S, CXA1562M/S
Package Outline
Unit: mm
CXA1561M, CXA1562M
24PIN SOP (PLASTIC)
+ 0.4
15.0 – 0.1
+ 0.4
1.85 – 0.15
24
13
0.15
+ 0.2
0.1 – 0.05
1
12
+ 0.1
0.2 – 0.05
0.45 ± 0.1
1.27
± 0.12
M
PACKAGE STRUCTURE
MOLDING COMPOUND
EPOXY/PHENOL RESIN
SOLDER PLATING
COPPER ALLOY / 42ALLOY
0.3g
LEAD TREATMENT
LEAD MATERIAL
SONY CODE
EIAJ CODE
SOP-24P-L01
SOP024-P-0300-A
JEDEC CODE
PACKAGE WEIGHT
CXA1560S, CXA1561S, CXA1562S
22PIN SDIP (PLASTIC)
+ 0.4
19.2 – 0.1
12
22
0° to 15°
1
11
1.778
0.5 ± 0.1
+ 0.15
0.9 – 0.1
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY RESIN
SONY CODE
SDIP-22P-01
SDIP022-P-0300
LEAD TREATMENT
SOLDER PLATING
EIAJ CODE
LEAD MATERIAL
COPPER ALLOY
0.95g
JEDEC CODE
PACKAGE WEIGHT
– 18 –
SONY [ SONY CORPORATION ]
