CXA1100/CXA1101/CXA1102/CXA1163
Package Outline
Unit: mm
CXA1101P, CXA1101P
CXA1102P, CXA1163P
16PIN DIP (PLASTIC) 300mil
16PIN DIP (PLASTIC) 300mil
+ 0.4
19.1 – 0.1
+ 0.4
19.2 – 0.1
16
1
9
0° to 15°
16
1
9
8
0° to 15°
2.54
8
2.54
0.46 ± 0.1
1.53 ± 0.15
0.5 ± 0.1
PACKAGE STRUCTURE
EPOXY RESIN
SOLDER PLATING
PACKAGE MATERIAL
LEAD TREATMENT
1.2 ± 0.15
SONY CODE
EIAJ CODE
DIP-16P-03
DIP016-P-0300-B
LEAD MATERIAL
COPPER / 42 ALLOY
1.0g
PACKAGE STRUCTURE
PACKAGE WEIGHT
JEDEC CODE
Similar to MO-001-AE
EPOXY RESIN
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
SOLDER PLATING
COPPER
SONY CODE
EIAJ CODE
DIP-16P-01
DIP016-P-0300-A
Similar to MO-001-AE
PACKAGE WEIGHT
JEDEC CODE
1.0 g
CXA1101M, CXA1102M
CXA1163M
CXA1100P, CXA1101P
CXA1102P
16PIN DIP (PLASTIC) 300mil
16PIN SOP (PLASTIC) 300mil
+ 0.4
9.9 – 0.1
+ 0.4
1.85 – 0.15
19.35 ± 0.5
16
9
0.15
16
1
9
0° to 10°
+ 0.2
0.1 – 0.05
8
2.54 ± 0.254
1
8
+ 0.1
0.2 – 0.05
0.45 ± 0.1
1.27
1.016
0.457 ± 0.076
M
± 0.12
PACKAGE STRUCTURE
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
EPOXY RESIN
PACKAGE MATERIAL
SONY CODE
EIAJ CODE
SOP-16P-L01
SOP016-P-0300-A
SOLDER PLATING
COPPER ALLOY
LEAD TREATMENT
LEAD MATERIAL
SOLDER PLATING
COPPER
SONY CODE
EIAJ CODE
DIP-16P-191
DIP016-P-0300-AU
JEDEC CODE
PACKAGE WEIGHT
0.2g
MS-001-AA
1.0g
JEDEC CODE
PACKAGE WEIGHT
– 14 –
SONY [ SONY CORPORATION ]
