High-Performance Small Form Factor Single-Chip Ethernet Controller with HP Auto-MDIX
Datasheet
Chapter 8 Package Outline
8.1
56-QFN Package
Figure 8.1 56 Pin QFN Package Definition
Table 8.1 56 Pin QFN Package Parameters
MIN
0.70
NOMINAL
MAX
1.00
REMARKS
Overall Package Height
A
~
A1
A2
D/E
D1/E1
D2/E2
L
0.00
~
0.02
0.05
0.90
8.15
7.95
6.05
0.50
0.30
Standoff
Mold Cap Thickness
X/Y Body Size
X/Y Mold Cap Size
X/Y Exposed Pad Size
Terminal Length
Terminal Width
~
8.00
~
5.90
~
7.85
7.55
5.75
0.30
0.18
b
e
0.25
0.50 Basic
Terminal Pitch
Notes:
1. All dimensions are in millimeters.
2. Position tolerance of each terminal and exposed pad is ± 0.05 mm at maximum material condition.
Dimension “b” applies to plated terminals and is measured between 0.15 and 0.30 mm from the
terminal tip.
3. The pin 1 identifier may vary, but is always located within the zone indicated.
SMSC LAN9211
145
Revision 1.93 (11-27-07)
DATASHEET
SMSC [ SMSC CORPORATION ]
