Non-PCI Single-Chip Full Duplex Ethernet Controller
Figure 13.2 - 100 Pin TQFP Package Outline
Table 13.2 - 100 Pin TQFP Package Parameters
MIN
~
NOMINAL
MAX
1.20
0.15
1.05
16.20
14.10
16.20
14.10
0.20
0.75
~
REMARKS
Overall Package Height
Standoff
A
A1
A2
D
~
0.05
0.95
15.80
13.90
15.80
13.90
0.09
0.45
~
~
~
Body Thickness
~
X Span
D1
E
~
X body Size
~
Y Span
E1
H
~
Y body Size
~
Lead Frame Thickness
Lead Foot Length
Lead Length
L
0.60
L1
e
1.00
0.50 Basic
Lead Pitch
Lead Foot Angle
Lead Width
0o
0.17
0.08
0.08
~
~
0.22
~
~
~
7o
0.27
~
0.20
0.08
θ
W
R1
Lead Shoulder Radius
Lead Foot Radius
Coplanarity
R2
ccc
Notes:
1 Controlling Unit: millimeter.
2 Tolerance on the true position of the leads is ± 0.04 mm maximum.
3 Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4 Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5 Details of pin 1 identifier are optional but must be located within the zone indicated.
Rev. 11/18/2004
Page 110
SMSC DS – LAN91C96I
DATASHEET
SMSC [ SMSC CORPORATION ]
