Non-PCI Single-Chip Full Duplex Ethernet Controller
Chapter 13 Package Outlines
Figure 13.1 - 100 Pin QFP Package Outline
Table 13.1 - 100 Pin QFP Package Parameters
MIN
~
NOMINAL
MAX
3.4
0.5
REMARKS
Overall Package Height
Standoff
A
A1
A2
D
D1
E
~
0.05
2.55
23.65
19.90
17.65
13.90
0.11
0.73
~
~
~
~
~
~
~
~
0.88
3.05
24.15
20.10
18.15
14.10
0.23
1.03
~
Body Thickness
X Span
X body Size
Y Span
Y body Size
E1
H
Lead Frame Thickness
Lead Foot Length
Lead Length
L
L1
1.95
e
0.65 Basic
Lead Pitch
Lead Foot Angle
Lead Width
0o
0.20
0.10
0.15
~
~
~
~
~
~
7o
θ
W
R1
R2
ccc
Notes:
0.40
0.25
0.40
0.10
Lead Shoulder Radius
Lead Foot Radius
Coplanarity
1 Controlling Unit: millimeter.
2 Tolerance on the true position of the leads is ± 0.065 mm maximum
3 Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4 Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5 Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC DS – LAN91C96I
Page 109
Rev. 11/18/2004
DATASHEET
SMSC [ SMSC CORPORATION ]
