10/100 Non-PCI Ethernet Single Chip MAC + PHY
Datasheet
Chapter 15 Package Outlines
Figure 15.1 128 Pin TQFP Package Outline, 14X14X1.0 Body
Table 15.1 128 Pin TQFP Package Parameters
MIN
NOMINAL
MAX
REMARK
A
~
~
~
1.20
0.15
1.05
16.20
8.10
14.20
16.20
8.10
14.20
0.20
0.75
~
Overall Package Height
Standoff
Body Thickness
A1
A2
D
D/2
D1
E
E/2
E1
H
0.05
0.95
15.80
7.90
13.80
15.80
7.90
13.80
0.09
0.45
~
1.00
16.00
8.00
14.00
16.00
8.00
14.00
~
X Span
1/2 X Span Measure from Centerline
X body Size
Y Span
1/2 Y Span Measure from Centerline
Y body Size
Lead Frame Thickness
Lead Foot Length from Centerline
Lead Length
Lead Pitch
Lead Foot Angle
L
L1
e
0.60
1.00
0.40 Basic
q
0o
~
7o
W
0.13
0.08
0.08
~
0.18
~
~
~
~
0.23
~
0.20
0.0762
0.08
Lead Width
R1
R2
ccc
ccc
Lead Shoulder Radius
Lead Foot Radius
Coplanarity (Assemblers)
Coplanarity (Test House)
~
Notes:
1. Controlling Unit: millimeter
2. Tolerance on the position of the leads is ± 0.035 mm maximum
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane is 0.78-1.08 mm.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
6. Shoulder widths must conform to JEDEC MS-026 dimension 'S' of a minimum of 0.20mm.
SMSC LAN91C111-REV B
141
Revision 1.8 (07-13-05)
DATASHEET
SMSC [ SMSC CORPORATION ]
