®
MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX and flexPWR Technology in a Small Footprint
Datasheet
Chapter 9 Package Outline
Figure 9.1 LAN8710/LAN8710i-EZK 32 Pin QFN Package Outline, 5 x 5 x 0.9 mm Body (Lead-Free)
Table 9.1 32 Terminal QFN Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
A1
A2
A3
D
D1
D2
E
E1
E2
L
e
b
0.70
0
~
~
0.02
~
1.00
0.05
0.90
Overall Package Height
Standoff
Mold Thickness
Copper Lead-frame Substrate
X Overall Size
0.20 REF
4.85
4.55
3.15
4.85
4.55
3.15
0.30
5.0
~
3.3
5.0
~
3.3
5.15
4.95
3.45
5.15
4.95
3.45
0.50
X Mold Cap Size
X exposed Pad Size
Y Overall Size
Y Mold Cap Size
Y exposed Pad Size
Terminal Length
Terminal Pitch
~
0.50 BSC
0.25
0.18
~
0.30
0.08
Terminal Width
Coplanarity
ccc
~
Notes:
1. Controlling Unit: millimeter.
2. Dimension b applies to plated terminals and is measured between 0.15mm and 0.30mm from the
terminal tip. Tolerance on the true position of the leads is ± 0.05 mm at maximum material
conditions (MMC).
3. Details of terminal #1 identifier are optional but must be located within the zone indicated.
4. Coplanarity zone applies to exposed pad and terminals.
Revision 1.0 (04-15-09)
SMSC LAN8710/LAN8710i
DATA7S6HEET
SMSC [ SMSC CORPORATION ]
