±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support and flexPWR® Technology in a Small Footprint
Datasheet
Chapter 7 DC Electrical Characteristics
7.1
DC Characteristics
7.1.1
Maximum Guaranteed Ratings
Stresses beyond those listed in may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 7.1 Maximum Conditions
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
COMMENT
VDD33,VDDIO Power pins to all other pins. -0.5
+3.6
+3.6
V
Digital IO
VSS
To VSS ground
-0.5
V
Table 7.5, “MII Bus
Interface Signals,” on
page 71
VSS to all other pins
LAN8700-AEZG
-0.5
0
+4.0
+70
V
C
Operating
Temperature
Commercial temperature
components.
Operating
LAN8700i-AEZG
-40
-55
+85
C
C
Industrial temperature
components.
Temperature
Storage
Temperature
+150
Table 7.2 ESD and LATCH-UP Performance
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
COMMENTS
ESD PERFORMANCE
All Pins
System
Human Body Model
±8
±8
kV
kV
Device
EN/IEC61000-4-2 Contact
Discharge
3rd party system test
System
EN/IEC61000-4-2 Air-gap
Discharge
±15
kV
3rd party system test
LATCH-UP PERFORMANCE
All Pins
EIA/JESD 78, Class II
150
mA
7.1.1.1
Human Body Model (HBM) Performance
HBM testing verifies the ability to withstand the ESD strikes like those that occur during handling and
manufacturing, and is done without power applied to the IC. To pass the test, the device must have
no change in operation or performance due to the event. All pins on the LAN8700 provide ±8kV HBM
protection.
Revision 2.3 (04-12-11)
SMSC LAN8700/LAN8700i
DATA6S8HEET
SMSC [ SMSC CORPORATION ]
