Mobile KBC with Super I/O, SFI, ADC and DAC with SMSC SentinelAlert!
TM
Package Outline
D
D1
3
GAUGE PLANE
0.25
0°-7°
E1/4
4
L
L1
DETAIL "A" (SCALE: 2/1)
D1/4
3
E1
e
b
5
2
6
E
TOP VIEW
3-D VIEW
SEE DETAIL "A"
A2
c
6
A1
C
A
SEATING PLANE
SIDE VIEW
ccc C
Figure 2 176-Pin TQFP Package Outline, 20X20X1.4 Body, 0.4 mm Footprint
Table 1 176-Pin TQFP Package Parameters
MIN
A
A1
A2
D/E
D1/E1
c
L
L1
e
b
ccc
~
0.05
1.35
21.80
19.80
0.09
0.45
NOMINAL
~
~
1.40
~
20.00
~
0.60
1.00 REF
0.40 BSC
~
~
MAX
1.60
0.15
1.45
22.20
20.20
0.20
0.75
REMARK
Overall Package Height
Standoff
Body Thickness
X/Y Span
X/Y Body Size
Lead Foot Thickness
Lead Foot Length
Lead Length
Lead Pitch
Lead Width
Coplanarity
0.13
~
0.23
0.08
Notes:
1. All dimensions are in millimeter.
2. True position spread tolerance of each lead is ±0.035 mm at maximum material condition.
3. Dimensions D1 and E1 do not include mold protrusions. Maximum allowed protrusion is 0.25mm
per side. D1 and E1 are maximum plastic body size dimensions including mold mismatch.
4. Dimension L is measured at the gauge plane, 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
6. Dimensions “b” and “c” apply to the flat section of the lead between 0.10mm and 0.25mm from the
lead tip.
Revision 0.8 (10-19-05)
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SMSC KBC1100
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