USB2.0 PHY IC
3
Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm per side.
4
Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
Details of pin 1 identifier are optional but must be located within the zone indicated.
5
Figure 9.3 USB3250-ABZJ (lead free) 56 Pin QFN Package Outline, 8x8x0.85mm Body
Table 9.3 USB3250-ABZJ (lead free) 56 Pin QFN Package Parameters
MIN
0.70
0
NOMINAL
MAX
REMARKS
Overall Package Height
Standoff
Mold Thickness
X Overall Size
X Mold Cap Size
X exposed Pad Size
Y Overall Size
A
A1
A2
D
D1
D2
E
E1
E2
L
~
0.02
~
8.00
~
~
8.00
~
1.00
0.05
0.80
8.15
7.95
6.80
8.15
7.95
6.80
0.50
~
7.85
7.55
2.25
7.85
7.55
2.25
0.30
Y Mold Cap Size
Y exposed Pad Size
Terminal Length
~
~
Revision 1.3 (10-05-04)
SMSC GT3200, SMSC USB3250
DATA4S5HEET
SMSC [ SMSC CORPORATION ]
