High-Side Current-Sense and Internal 1°C Temperature Monitor
Datasheet
Chapter 2 Electrical Characteristics
Table 2.1 Absolute Maximum Ratings
-0.3 to 5.5
Voltage on 5V tolerant pins
V
Voltage on 2V tolerant pins
-0.3 to 2
V
Voltage on VDD, SENSE- and SENSE+ pins
Voltage on any other pin to GND
-0.3 to 26
V
-0.3 to 4
V
Voltage between Sense pins ( |(SENSE+ - SENSE-)| )
Package Power Dissipation
< 6
V
0.5W up to TA = 85°C
W
Junction to Ambient (θJA) (QFN12 package)
Junction to Ambient (θJA) (MSOP10 package)
Operating Ambient Temperature Range
Storage Temperature Range
58
°C/W
°C/W
°C
°C
V
128
-40 to 85
-55 to 150
4000
ESD Rating - SMCLK, SMDATA, ALERT, THERM pins - HBM
ESD Rating - All other pins - HBM
2000
V
Note 2.1 Stresses at or above those values listed could cause permanent damage to the device.
This is a stress rating only, and functional operation of the device at any other condition
above those indicated in the operation sections of this specification is not implied.
Prolonged stresses above the stated operating levels and below the Absolute Maximum
Ratings may degrade device performance and lead to permanent damage.
Note 2.2 All voltages are relative to ground.
Note 2.3 The Package Power Dissipation specification assumes a thermal via design with the
thermal landing be soldered to the PCB ground plane with four 12 mil vias (where
applicable).
Note 2.4 Junction to Ambient (θJA) is dependent on the design of the thermal vias. Without thermal
vias and a thermal landing, the θJA is approximately 60°C/W (EMC1701-1) including
localized PCB temperature increase.
Revision 1.2 (09-27-10)
SMSC EMC1701
DATA1S0HEET
SMSC [ SMSC CORPORATION ]
