1°C Triple SMBus Sensor with Resistance Error Correction
Datasheet
Chapter 6 Package Outlines
Figure 6.1 8-Pin TSSOP Package Outline - 3x3mm Body 0.65mm Pitch
Table 6.1 8-Pin TSSOP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
A1
A2
D
0.80
0.05
0.75
2.80
4.65
2.80
0.08
0.40
~
1.10
0.15
0.95
3.20
5.15
3.20
0.23
0.80
Overall Package Height
Standoff
~
0.85
Body Thickness
X Body Size
3.00
E
4.90
Y Span
E1
H
~
Y body Size
~
Lead Foot Thickness
Lead Foot Length
Lead Length
L
~
L1
e
0.95 REF
0.65 BSC
Lead Pitch
0o
0.22
~
~
~
~
8o
Lead Foot Angle
Lead Width
θ
W
ccc
0.38
0.10
Coplanarity
Notes:
1. Controlling Unit: millimeters.
2. Tolerance on the true position of the leads is ± 0.065 mm maximum.
3. Package body dimensions D and E1 do not include mold protrusion or flash. Dimensions D and
E1 to be determined at datum plane H. Maximum mold protrusion or flash is 0.15mm (0.006 inches)
per end, and 0.15mm (0.006 inches) per side.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Revision 1.1 (01-19-07)
SMSC EMC1033
DATA2S4HEET
SMSC [ SMSC CORPORATION ]
