1°C Dual SMBus Sensor with Resistance Error Correction
Package Outlines
Figure 1 8-Pin MSOP and 8-Pin MSOP (Lead-Free) Package Outline - 3x3mm Body 0.65mm Pitch
Table 1 8-Pin MSOP and 8-Pin MSOP (Lead-Free) Package Parameters
MIN
A
A1
A2
D
E
E1
H
L
L1
e
0.80
0.05
0.75
2.80
4.65
2.80
0.08
0.40
NOMINAL
~
~
0.85
3.00
4.90
~
~
~
0.95 REF
0.65 BSC
0
o
0.22
~
~
~
~
8
o
0.38
0.10
MAX
1.10
0.15
0.95
3.20
5.15
3.20
0.23
0.80
REMARKS
Overall Package Height
Standoff
Body Thickness
X Body Size
Y Span
Y body Size
Lead Foot Thickness
Lead Foot Length
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Coplanarity
θ
W
ccc
Notes:
1. Controlling Unit: millimeters.
2. Tolerance on the true position of the leads is ± 0.065 mm maximum.
3. Package body dimensions D and E1 do not include mold protrusion or flash. Dimensions D and
E1 to be determined at datum plane H. Maximum mold protrusion or flash is 0.15mm (0.006 inches)
per end, and 0.15mm (0.006 inches) per side.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC EMC1002
3
Revision 1.2 (04-15-05)
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SMSC [ SMSC CORPORATION ]
