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DME1737 参数 Datasheet PDF下载

DME1737图片预览
型号: DME1737
PDF下载: 下载PDF文件 查看货源
内容描述: 超级I / O与温度 [SUPER I/O WITH TEMPERATURE]
分类和应用:
文件页数/大小: 5 页 / 176 K
品牌: SMSC [ SMSC CORPORATION ]
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Package Outline
Figure 2 128 Pin QFP Package Outline, 14X20X2.7 Body, 3.2 mm Footprint
Table 1 128 Pin QFP Package Parameters
A
A1
A2
D
D1
E
E1
H
L
L1
e
q
W
R1
R2
ccc
MIN
~
0.05
2.55
23.00
19.90
17.00
13.90
0.09
0.73
~
0
o
0.10
0.08
0.08
~
Notes:
1.
2.
3.
4.
5.
6.
7.
NOMINAL
~
~
~
23.20
20.00
17.20
14.00
~
0.88
1.60
0.50 Basic
~
~
~
~
~
MAX
3.4
0.5
3.05
23.40
20.10
17.40
14.10
0.20
1.03
~
7
o
0.30
~
0.30
0.08
REMARKS
Overall Package Height
Standoff
Body Thickness
X Span
X body Size
Y Span
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity
Controlling Unit: millimeter.
Controlling Unit: millimeter.
Tolerance on the position of the leads is ± 0.04 mm maximum.
Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC DME1737
PRODUCT PREVIEW
5
Rev. 05-21-04