DATA SHEET • SKY65233-11
Recommended Footprint
Solder Mask
10.34 mm
10.44 mm
0.425 mm
48X 0.6 mm
Pin 47
0.425 mm
24X 0.5 mm
Pin 48
24X 0.75 mm
0.20 X 45
Pin 1
48X 0.85 mm
Pin 1
0.175 mm
Typ.
0.85 mm Typ.
6X 0.725 mm
6X 2.1 mm
6X 5 mm
0.85 mm Typ.
0.35 mm
1.4 mm
C
L
C
L
1.4 mm
0.7 mm
14.44 mm
0.425 mm
14.34 mm
2.2 mm Typ.
0.25 mm
Typ.
C
L
C
L
Package Outline
2X 1.525 mm
2X 1.875 mm
0.7 mm
2 mm Typ.
Thermal Via Array
0.3 mm on 0.7 mm Pitch
Additional Vias in Common Ground
Pad Will Improve Thermal Performance
0.35mm
8X 2.3 mm 2X 4.075 mm
Thermal vias should be tented and filled with solder mask 30–35 µm
copper plating recommended.
Stencil Pattern
10.34 mm
0.20 X 45 mm
48X 0.5 mm
0.425 mm
48X 0.75 mm
0.85 mm Typ.
6X 5 mm
0.425 mm
C
L
14.34 mm
6X 2.1 mm
Package
Outline
Stencil Aperture
Size of 80–100%
of the Module/Pkg.
C
L
8X 2.3 mm
Solder Mask Openings
2X 2.975 mm
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
May 7, 2007 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200607 Rev. D
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