ST7781
3. Pad Arrangement
Chip Size: 18163um x 800um
DUMMY
G319
G317
G315
G313
G311
G309
G307
G305
G303
Chip Thickness : 280um or 300um (typ.)
DUMMY
SW_EE
DUMMY
DUMMY
DUMMY
TESTO
IM0
IM1
IM2
IM3
Pad Location: Pad Center.
Coordinate Origin: Chip Center
Au Bump Height: 15um (typ.)
Au Bump Size:
DUMMY
TESTO
TESTO
TESTO
TESTO
TESTO
TESTO
TESTO
RESET
RESET
TESTI
TESTI
TESTI
TESTI
DB17
DB16
DB15
DB14
DB13
G
17
15
13
11
9
DUMMY
G
G
G
G
G
G
G
G
DB12
DB11
DB10
DB9
DB8
7
DUMMY
DUMMY
DB7
5
3
DB6
DB5
1
DUMMY
DUMMY
DB4
DB3
1. 16um x 90um
Gate: G1 ~ G320
Source: S1 ~ S720
DB2
S
S
S
S
S
S
S
S
S
1
2
3
4
5
6
7
8
9
DB1
DB0
DUMMY
SDO
SDI
/RD
/WR /SCL
RS
/CS
DUMMY
OSC
FMARK
DUMMY
TESTI
TESTI
TESTI
TESTI
2. 50um x 80um
Input Pads
Pad 1 to 243.
DUMMY
DUMMY
TESTO
TESTO
DUMMY
DUMMY
VDDI
VDDI
VDDI
VDDI
VDDI
VDDI
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
Alignment Marks
15
10
20
15
VCC
VCC
VCC
DUMMY
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
S353
S354
S355
S356
S357
S358
S359
S360
DUMMY
15
20
15
10
AGND
AGND
AGND
AGND
V25
DUMMY
DUMMY
VCOM
VCOM
VCOM
VCOM
VCOM
VCOM
VCOM
VCOMH
VCOMH
VCOMH
VCOMH
VCOMH
VCOMH
VCOML
VCOML
VCOML
VCOML
GVDD
GVDD
GVDD
DUMMY
DUMMY
DUMMY
DUMMY
S361
S362
S363
S364
S365
S366
S367
S368
S369
VCL
VCL
VCL
VCL
VCL
AVDD
AVDD
AVDD
AVDD
AVDD
Alignment Mark: A1 (X , Y) = (-8751 , 252.5)
AVDD
VCI1
VCI1
VCI1
VDD
VDD
VDD
VDD
VDD
VDD
15
20
15
10
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
10
15
20
15
VDD
VDD
TESTO
TESTO
C12N
C12N
C12N
C12N
C12N
C12P
Y
C12P
C12P
C12P
C12P
C11N
C11N
C11N
C11N
C11N
C11P
C11P
C11P
C11P
C11P
VGL
VGL
VGL
X
VGL
VGL
S712
S713
S714
S715
S716
S717
S718
S719
S720
DUMMY
DUMMY
G2
VGL
VGL
VGL
VGL
VGL
AGND
AGND
AGND
VGH
VGH
VGH
VGH
VGH
Alignment Mark: A2 (X , Y) = (8751 , 252.5)
VGH
DUMMY
DUMMY
C21N
G4
G6
C21N
C21N
G8
C21N
G10
C21P
G12
C21P
C21P
C21P
C22N
C22N
C22N
C22N
C22N
C22N
C22N
G14
G16
G18
C22P
C22P
C22P
C22P
C22P
C22P
C22P
C23N
C23N
C23N
Bump View
C23N
C23N
C23N
C23N
C23P
C23P
C23P
C23P
C23P
C23P
G304
G306
G308
G310
G312
G314
G316
G318
G320
DUMMY
C23P
DUMMY
DUMMY
Ver. 1.7
2