ST7669
3 Pad Arrangement (COG)
232 COM 59
231 COM 57
207 COM 9
206 TRBI
205 TRBO
234 TRUO
233 TRUI
Chip Size :
14030 um x 970 um
Bump Pitch :
PAD 1 ~ 30, 31 ~ 35 pitch=27um(min, com/seg)
PAD 200 ~ 204, 205 ~ 737 pitch=27um(min, com/seg)
PAD 36 ~ 199 pitch=80um (I/O)
PAD 87,88 pitch= 79.72um(I/O)
Bump Size :
PAD 1 ~ 35 , PAD 200 ~ 737
Bump width=14um(min, com/seg)
Bump space=13um(min, com/seg)
Bump length=128um(min, com/seg)
Bump area=1800um^2(com/seg)
PAD 36 ~86,89~199(except 87,88)
Bump width=65um(I/O)
Bump space=15um(I/O)
Bump length=63um(I/O)
Bump area=4095um^2
PAD 87,88
Bump width=65um(I/O)
Bump space=14.72um(I/O)
Bump length=63um(I/O)
Bump area=4095um^2
Bump Height :
15 um
Chip Thickness :
400 um
Aligment mark
The center of alignment mark: see bellow Table
Ver 1.3a
27 COM 10
28 COM8
29 TLBI
30 TLBO
1 T LUO
2 TLUI
3 COM58
4 COM56
2/216
3/2/2009
SITRONIX [ SITRONIX TECHNOLOGY CO., LTD. ]
