ST7628
3. ST7628 Pad Arrangement (COG)
Chip Size :
10070 um x 780 um
Bump Pitch :
PAD 1~2, 3~14 pitch=27um(min, com/seg)
PAD 138~149, 150~517 pitch=27um(min, com/seg)
PAD 2~3, 149~150 pitch=28.79um(min, com/seg)
PAD 15 ~ 28, 29~137 pitch=80um (I/O)
PAD 28~29 pitch = 79.72um(I/O)
Bump Size :
152ꢀCOM5
137ꢀVSS
136ꢀVgIn
135ꢀVgIn
130ꢀVgIn
129ꢀVgIn
184ꢀCOM69
188 SEG0
128ꢀVgS
127ꢀVgOut
126ꢀVgOout
125ꢀXV0In
124ꢀXV0In
123ꢀXV0In
122ꢀXV0In
121ꢀXV0S
120ꢀXV0Out
119ꢀXV0Out
118ꢀV0Out
117ꢀV0Out
116ꢀV0S
115ꢀV0In
114ꢀV0In
113ꢀV0In
112ꢀV0In
111ꢀVREF
110ꢀVm
PAD 1 ~ 14 , PAD 138 ~ 517
Bump width=14um(min, com/seg)
Bump space=13um(min, com/seg)
Bump length=128um(min, com/seg)
Bump area=1800um^2(com/seg)
PAD 15 ~28, 29~137
109ꢀVDD2
100ꢀVDD2
99ꢀVDD5
98ꢀVDD5
97ꢀVDD5
96ꢀVDD5
95ꢀVDD5
94ꢀVDD5
93ꢀVDD5
92ꢀVDD5
91ꢀVDD4
90ꢀVDD4
89ꢀVDD3
88ꢀVDD3
87ꢀVSS4
86ꢀVSS4
Bump width=65um(I/O)
85ꢀVSS2
84ꢀVSS2
83ꢀVSS2
82ꢀVSS2
Bump space=15um(I/O)
X
76ꢀVSS2
75ꢀVSS2
74ꢀVSS2
Bump length=63um(I/O)
(0,0)
Y
73ꢀVSS
72ꢀVSS
71ꢀVSS
Bump area=4095um^2
70ꢀVSS
69ꢀVSS1
68ꢀVSS1
67ꢀVDD
66ꢀVDD
65ꢀVDD
64ꢀVDD
63ꢀVDD
62ꢀVDD
PAD 28~29
Bump width=65um(I/O)
61ꢀTCAP
60ꢀTE
59ꢀ/EXT
Bump space=14.72um(I/O)
Bump length=63um(I/O)
58ꢀ/CS
57ꢀVDD
56ꢀVSS
55ꢀIF3
54ꢀIF2
53ꢀIF1
Bump area=4095um^2
52ꢀCSEL
51ꢀRST
50ꢀE_RD
49ꢀVDD
48ꢀVSS
47ꢀD15
46ꢀD14
45ꢀD13
44ꢀD12
43ꢀD11
42ꢀD10
41ꢀD9
Bump Height : 15 um
Chip Thickness : 400 um
Alignment mark
40ꢀD8
39ꢀD7
38ꢀD6
37ꢀD5
36ꢀD4
The center of alignment mark: see bellow Table
35ꢀD3
34ꢀD2
33ꢀD1
32ꢀD0
Left L-Mark
Right L-Mark
31ꢀRW_WR
30ꢀA0
29ꢀVDD
28ꢀCLS
27ꢀCL
55
55
26ꢀVPP
25ꢀVPP
24ꢀVPP
23ꢀVPP
22ꢀVSS
21ꢀdummy
15
15
15
15
481 SEG293
485 COM68
57
57
Center
Center
15ꢀdummy
517 COM4
15 15
15 15
Ver 1.4
2/213
2008/08
SITRONIX [ SITRONIX TECHNOLOGY CO., LTD. ]
