ST7625
3. ST7625 Pad Arrangement (COG)
Chip Size :
9,930 um x 820 um
Bump Pitch :
PAD NO. 1 ~ 30, 143 ~ 514 : 27 um (COM/SEG)
PAD NO. 31 ~ 142 : 80 um (I/O)
Bump Size :
PAD NO. 1 ~ 25, 148 ~ 172 :
120.5 um(x) ~ 15 um(y)
(COM)
PAD NO. 26 ~ 30, 143 ~ 147, 173 ~ 514 :
15 um(x) ~ 120.5 um(y)
(COM/SEG)
PAD NO. 31 ~ 142 :
65 um(x) ~ 63 um(y)
(I/O)
Bump Height :
15 um
41.78
62.77
30
30
(4693,127)
84.63
155.67
30
11.78
15
Bump size of
PAD 26~30
PAD 143~147
PAD 173~514
(2288,-65)
54.63
(-4528.36,-351.73)
125.67
Unit : um
41.89
15
Unit : um
32.77
30
20
32.41
21.89
20
Unit : um
52.41
120.5
Bump size of
PAD 1~25
PAD 148~172
120.5
65
Bump size of
PAD 31~142
Unit : um
63
Ver 1.6
2/160
2008/07