ST7588T 参数 Datasheet PDF下载

ST7588T

n

PAD ARRANGEMENT (COG)

Chip Size: 7,708

μm ×

980

μm

Bump Pitch: (minimum)

PAD NO 1~185, 248~276: 45μm (COM/SEG)

PAD NO 186~187, 188~189, 191~192, 193~194, 195~196, 197~198, 199~200, 201~202, 213~214,215~216: 119μm

PAD NO 187~188, 189~190, 192~193, 194~195, 196~197, 198~199, 200~201, 209~211, 212~213, 214~215, 216~217,

218~220: 73μm

PAD NO 190~191: 134μm;

PAD NO 220~221: 93μm;

Bump Size:

PAD NO 1~156, 174~185, 248~259: 30(x)

μm ×

80(y)

μm

PAD NO 157~173, 260~276: 80(x)

μm ×

30(y)

μm

PAD NO 186~202, 209~247: 55(x)

μm ×

60(y)

μm

PAD NO 203~208: 45(x)

μm ×

60(y)

μm

Bump Height: 17

μm

Chip Thickness: 480

μm

PAD NO 202~203: 77μm;

PAD NO 208~209: 68μm;

PAD NO 204~205, 206~207: 75μm

PAD NO 211~212, 217~218: 102μm

PAD NO 243~244: 145μm

PAD NO 221~243, 244~247: 70μm

PAD NO 203~204, 205~206: 175μm;

PAD NO 207~208: 150μm;

Ver 1.3

2/61

2007/09/20