ST7578
3. ST7578 Pad Arrangement
Chip Size: 5570 um ×770 um
Bump Height: 15 um
Chip Thickness: 480 um
Bump Pitch: (minimum)
Unit: um
Pitch
46.65
33.30
38.80
46.30
66.40
62.45
79.90
PAD Number
Pitch
37.20
33.00
62.90
60.69
329.57
59.30
131.83
71.30
PAD Number
1~27, 130~156, 157~163, 243~250
212~213
28~129
213~216,218~221
216~217,217~218
221~222
27~28
129~130
163~164
228~229
164~207, 208~211,222~228,229~235,236~242
235~236
207~208
211~212
242~243
* Refer to “Pad Center Coordinates” section for ITO layout.
Fig 1.
Ver 1.2
2/52
2007/04/30