點晶科技股份有限公司
ST2225A
SILICON TOUCH TECHNOLOGY INC.
Die Configuration
OUTPUT BIT 13
OUTPUT BIT 12
OUTPUT BIT 11
OUTPUT BIT 10
OUTPUT BIT 9
OUTPUT BIT 8
OUTPUT BIT 7
VSS
OUTPUT BIT 23
OUTPUT BIT 24
OUTPUT BIT 25
OUTPUT BIT 26
OUTPUT BIT 27
OUTPUT BIT 28
OUTPUT BIT 29
VSS
OUTPUT BIT 6
OUTPUT BIT 5
OUTPUT BIT 4
OUTPUT BIT 3
OUTPUT BIT 2
OUTPUT BIT 1
OUTPUT BIT 30
OUTPUT BIT 31
OUTPUT BIT 32
OUTPUT BIT 33
OUTPUT BIT 34
OUTPUT BIT 35
(0, 0)
Die Size: 1449.6um * 2614um
Pad Size: 100um * 100um
Figure 3
* Note: SiTI reserves the right to improve the device geometry and
manufacturing processes without prior notice. Though these improvements
may result in slight geometry changes, they will not affect die electrical
characteristics and pad layouts.
Wafer Information
Material： Silicon with P-Substrate
Diameter： 6 inches(≒15cm)
Thickness： 12 mils(≒300um)
Width of scribe line：100um
Malfunctioned die：Marked with red ink or equivalent marking
LED Display Driver
-3-
Version：A.025
SITI [ SILICON TOUCH TECHNOLOGY INC. ]
