MT1118
◆
ABSOLUTE MAXTMUM RETINGS
SYMBOL
PARAMETER
Input supply voltage
Thermal resistance junction to ambient
SOT-89
SOT-23 & SOT-23-5
MAXIMUM
6
71
230
UNITS
V
IN
θ
JA
V
O
C/W
O
T
J
Operating junction temperature range
150
C
O
T
STG
Storage temperature range
- 65 to 150
C
O
T
LEAD
Lead temperature (soldering) 10sec
260
C
Note 1:
Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents
are positive into, negative out of the specified terminal.
◆
ORDERING INFORMATION
DEVICE
MT1118X-X.XJ
MT1118X-XXY
PACKAGE
V
OUT
VOLTS
X.X_ 1.5/ 1.8/ 2.5/ 2.8/ 3.0/ 3.3
X_1/ 2, Y_A/ B/ C/ D/ E/ F
(max)A
500mA
300mA
T
A
(
O
C)
-40 ~ 85
-40 ~ 85
J
S
SOT-89
SOT-23
◆
POWER DISSIPATION TABLE:
θ
JA
Package
O
( C /W )
J
S
N
71
230
230
O
Df( mW/ C)
T
A
≥
25
O
C
O
T
A
≤
25 C
Power rating(mW)
T
A
=70
O
C
Power rating(mW)
1128
239
239
T
A
= 85
O
C
Power rating (mW)
916
187
187
14.1
3.5
3.5
1763
397
397
Note :
1. Exceeding the maximum allowable power disspation will result in excessive die temperature, and the regulator will go into
thermal shutdown.
2.T
J:
Junction Temperature Calculation:
T
J
= T
A
+ (P
D
× θ
JA
)
The
θ
JA
numbers are guidelines for the thermal performance of the device/PC-board system. All of the above assume no
ambient airflow.
3.θ
JA
:
Thermal Resistance-Junction to Ambient, D
F
: Derating factor, Po: Power consumption.
4.θ
JT:
Thermal Resistance-Junction to Ambient, T
C
: case(Tab) temperature,
T
J
= T
C
+ (P
D
× θ
JT
)
for S package.
◆
RECOMMENDED OPERATING CONDITIONS:
Symbol
V
IN
I
O
T
J
Input Voltage
Load Current (with adequate heatsinking)
Junction temperature
Parameter
Recommended Operating
Min.
Typ.
Max.
2.8
5.5
5
125
Units
V
mA
O
C
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-2-
SIRECT [ Sirectifier Global Corp. ]
