Preliminary
STK14EC8
Document Revision History
Rev
1.0
Date
Change
Moved to Preliminary from Advance Information
April 2007
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made clear that nominal supply is 3.3V, not 3.0V (range 2.7V to 3.6V)
modified language on pin description of HSB and NC.
changed ISB from 1mA to 2mA.
changed Icc3 from 8mA to 13mA
clarified description language of Figure 3
clarified description language of Software Recall
clarified description language of Preventing Autostore
corrected typo on Industrial temp range: -45 to -40
Made the following changes to the document
1.1
January 2008
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page 1: revised block diagram
page 2: added new 48 FBGA information and added pin descriptions for pins E and W.
page 3: added thermal characteristics. In the DC Characteristics table, revised values for
Icc2, Icc4, ISB, VIH, Vcc, and VCAP; and changed Industrial Max Value of VCAP to 180 and
revised VCAP notes. Added “(except HSB)” to notes for Output Logic “1”
Voltage.
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page 5: in SRAM Read Cycles #1 & #2 table, revised parameter description for tELQX and
t
tEHQZ and changed Symbol #2 to
for Read Cycle Time; updated SRAM Read
ELEH
Cycle #2 timing diagram and changed title to add G controlled.
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page 7: in AutoStore/Power-Up Recall table, changed max value for #23 (tSTORE) to 12.5.
page 8: in Software-Controlled Store/Recall Cycle table, revised values for tRECALL
;
revised the notes below the Software-Controlled Store/Recall Cycle diagram.
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page 10: in Mode Selection table, changed column to A18-A0; in the values in this column,
added a zero after each instance of “0x”; changed AutoStore Enable value to
0x04B46.
page 11: in Auto-Store Operation, deleted line about VCAP pin being driven to 5V by a
charge pump internal to the chip. Also, added Stefan's revised text (italics show revision):
"Refer to the DC CHARACTERISTICS table for the size of the capacitor."
page 12: under Hardware Store (HSB) Operation, revised first paragraph to read “The
HSB pin has a very resistive pullup...”
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page 13: added best practices section.
page 15: in Ordering Information, Lead Finish, replaced “Sn (Matte Tin) RoHS Compliant”
with “Nickel/Palladium/Gold (Ni/Pd/Au)”;, added “B = Plastic 48-pin FBGA (Fine Pitch Ball
Grid Array)” to Finish.
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page 16: in Ordering Codes, added ordering information for 48 FBGA and added access
times column.
SIMTEK STK14EC8 Datasheet, January 2008
Copyright 2008, Simtek Corporation. All rights reserved.
This datasheet may only be printed for the expressed use of Simtek Customers. No part of the datasheet may be reproduced in any other
form or means without the express written permission from Simtek Corporation. The information contained in this publication is believed to be
accurate, but changes may be made without notice. Simtek does not assume responsibility for, or grant or imply any warranty, including
MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE regarding this information, the product or its use, Simtek products are
not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an
express written agreement with Simtek. Furthermore, Simtek does not authorize its products for use as critical components in life-support
systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Simtek products
in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Simtek against all
charges. Nothing herein constitutes a license, grant or transfer of any rights to any Simtek patent, copyright, trademark, or other proprietary
right.
Rev 1.1
Document Control #ML0060
Jan, 2008
19
Simtek Confidential
SIMTEK [ SIMTEK CORPORATION ]
