Preliminary
STK14EC16
Document Revision History
Rev
1.0
Date
Change
Moved to Preliminary from Advance Information
April 2007
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made clear that nominal supply is 3.3V, not 3.0V (range 2.7V to 3.6V)
modified language on pin description of HSB and NC.
changed ISB from 1mA to 2mA.
changed Icc3 from 8mA to 26mA
clarified description language of Figure 3
clarified description language of Software Recall
clarified description language of Preventing Autostore
corrected typo on Industrial temp range: -45 to -40
Made the following changes to the document
1.1
January 2008
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page 1: revised block diagram
page 3: added new 48 FBGA information, bock diagram, and package diagram; added
pin descriptions for pins E, LB, UB, and W.
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page 4: added thermal characteristics. In the DC Characteristics table, revised values for
I
, I , I , V , and V
;and changed Industrial Max Value of V
to 180 and
cc2 cc4 SB
IH
CAP
CAP
revised V
notes. Added “(except HSB)” to notes for Output Logic “1” Voltage.
CAP
page 6: in SRAM Read Cycles #1 & #2 table, revised description for t
and t
and
EHQZ
ELQX
t
changed Symbol #2 to
for Read Cycle Time; updated SRAM Read Cycle #2 timing
ELEH
diagramand changed title to add G controlled.
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page 7: in SRAM Write Cycles, added symbol #3.
page 8: added new SRAM Write Cycle #3. In AutoStore/Power-Up Recall table, changed
max value for #27 (t
) to 12.5. Revised AutoStore/Power-Up Recall section.
STORE
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page 9: in Software-Controlled Store/Recall Cycle table, revised values for t
revised the notes below the Software-Controlled Store/Recall Cycle diagram.
;
RECALL
page 11: in Mode Selection table, changed column to A -A . In the values in this column,
17
0
added a zero after each instance of “0x”; changed AutoStore Enable value to
0x04B46.
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page 12: in Auto-Store Operation, deleted line about V
charge pump internal to the chip. Also, Added Stefan's revised text (italics show revision):
"Refer to the DC CHARACTERISTICS table for the size of the capacitor."
pin being driven to 5V by a
CAP
page 13: under Hardware Store (HSB) Operation, revised first paragraph to read “The
HSB pin has a very resistive pullup...”
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page 14: added best practices section.
page 16: in Ordering Information, Lead Finish, replaced “Sn (Matte Tin) RoHS Compliant”
with “Nickel/Palladium/Gold (Ni/Pd/Au).” Also, added “B = Plastic 48-pin FBGA (Fine
Pitch Ball Grid Array)” to Finish.
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page 17: in Ordering Codes, added ordering information for 48 FBGA and added access
times column.
21
Rev 1.1
Document Control #ML0061
Jan, 2008
Simtek Confidential
SIMTEK [ SIMTEK CORPORATION ]
