STK11C88
Document Revision History
Revision
0.0
Date
December 2002
September 2003
March 2006
Summary
Removed 20 nsec device
0.1
Added lead free lead finish
0.2
Removed 35ns device, Removed Leaded Lead Finish, Removed DIP packages.
February 2007
Add fast power-down slew rate information
Add Tape & Reel Ordering Options
Add Product Ordering Code Listing
Add Package Outline Drawings
Reformat Entire Document
0.3
SIMTEK STK11C88 Datasheet, February 2007
Copyright 2007, Simtek Corporation. All rights reserved.
This datasheet may only be printed for the expressed use of Simtek Customers. No part of the datasheet may be reproduced in any other
form or means without the express written permission from Simtek Corporation. The information contained in this publication is believed to be
accurate, but changes may be made without notice. Simtek does not assume responsibility for, or grant or imply any warranty, including
MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE regarding this information, the product or its use. Nothing herein consti-
tutes a license, grant or transfer of any rights to any Simtek patent, copyright, trademark, or other proprietary right.
Rev 0.3
Document Control #ML0012
February 2007
14
SIMTEK [ SIMTEK CORPORATION ]
