Statement of Material Content
Ceramic LCC Packages
STK11C68-L
STK12C68-L
STK14C88-L
This package type is not available in a lead-free version.
Unit
Detail
28 350 LEADLESS CHIP CARRIER
32 450 LEADLESS CHIP CARRIER
ASSEMBLY MATERIALS
Die Attach
JMI 7000
Johnson Matthey
Silver Glass
0.5 - 1.0 mil
19 mil
JMI 7000
Manufacturer
Johnson Matthey
Silver Glass
0.5 - 1.0 mil
19 mil
Die Attach Type
Die Attach Thickness
Die Thickness
mil
mil
Die Coating
None
None
Wire Bond Material
Wire Bond Diameter
Al 99.99%
1.25 mil
Al 99.99%
1.25 mil
mil
ASSEMBLY PROCESS FLOW
Flow ID
P596-0501-0202
P596-0501-0202
Wafer Mount
Non Contact
Non Contact
Scribe Method
Complete Saw Through
CO2 bubbler
Complete Saw Through
CO2 bubbler
Saw/Clean
2nd optical
High Power. 100%
High Power. 45 C=0
Manual
High Power. 100%
High Power. 45 C=0
Manual
2nd optical QA
Die Attach Method
Die Attach Cure
Bonder: Manual/Auto
Bond Type: Forward/Reverse
Bond Type: At The Die
Bond Type: At The Paddle
3rd Optical
150-160°C, 10-30 minutes
Automatic
150-160°C, 10-30 minutes
Automatic
Reverse
Reverse
Ball
Ball
Stitch
Stitch
Low & High Power. 100%
Low & High Power. 45 C=0
Furnace / Nitrogen
Peak 420+/-5°C
Low & High Power. 100%
Low & High Power. 45 C=0
Furnace / Nitrogen
Peak 420+/-5°C
3rd Optical QA
Seal Method/Atmosphere
Lid Seal Temp Profile
°C
min
min
Dwell 7-10 Minutes @ 410°C
Rise 60.5 Min 100-400°C
Cool 2.0-3.5 minutes 400-200°C
Markem 4489 White
[lot #] [assembly country]
150°C+10°C -0°C 1hr +30 -0 minutes
100% 10 cycles, -65°C to +150°C
100% 30KG
Dwell 7-10 Minutes @ 410°C
Rise 60.5 Min 100-400°C
Cool 2.0-3.5 minutes 400-200°C
Markem 4489 White
[lot #] [assembly country]
150°C+10°C -0°C 1hr +30 -0 minutes
100% 10 cycles, -65°C to +150°C
100% 30KG
Marking Ink
Backside Mark
Ink Cure
Temp Cycle
Centrifuge
100% He 5x10-8 atm cc/sec
100% 5torr 0.5H 75psig 1H
100%
100% He 5x10-8 atm cc/sec
100% 5torr 0.5H 75psig 1H
100%
Fine Leak
Gross Leak
Final Visual QA
Pack & Ship
45, C=0
45, C=0
PROCESS MONITORS
Wire Bond Monitor
Die Attach Monitor
Lid Seal Monitor
Amkor Procedure
Amkor Procedure
Amkor Procedure
Amkor Procedure
Amkor Procedure
Amkor Procedure
PIND Monitor
Amkor Procedure
Amkor Procedure
Lead Trim Monitor
Seal Area Particulate Monitor
Area Particle Count Limits
Amkor Procedure
Amkor Procedure
Amkor Procedure
Amkor Procedure
10,000 In D/A, Wire Bond Areas
10,000 In D/A, Wire Bond Areas
PL0122
Simtek Corporation
August 07
SIMTEK [ SIMTEK CORPORATION ]
