SSF3055
TO-252 PACKAGE INFORMATION
NOTES:
1. No current JEDEC outline for this package.
2. L
3
and b
3
dimensions establish a minimum mounting surface for terminal 3.
3. Dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder plating.
5. L
1
is the terminal length for soldering.
6. Position of lead to be measured 0.090 inches (2.28mm) from bottom of dimension D.
7. Controlling dimension: Inch.
©
Silikron Semiconductor CO.,LTD.
2008.7.29
Version : 1.0
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