Silan
Semiconductors
TX-2B/RX-2B
ABSOLUTE MAXIMUM RATINGS
Cha ra c te ristic
Supply Voltage
Symbol
VDD
Va lue
Unit
V
0.3~5.0
GND-0.3~VDD+0.3
-10~65
Input / Output Voltage
Operating Temperature
Storage Temperature
VIN, VOUT
TOPR
V
°C
°C
Tstg
-25~125
ELECTRICAL CHARACTERISTICS
1. TX-2B (VDD=4.0V, Fosc=128KHz, Tamb =25°C, unless otherwise specified.)
Cha ra c te ristic
Operating Voltage
Symbol
VDD
Min
1.5
--
Typ
4.0
--
Ma x
5.0
2.0
10
Unit
V
Operating Current
Stand-By Current
IDD
mA
µA
ISTB
--
--
DC O/P Driving Current
AC O/P Driving Current
AC O/P Frequency
Idrive
Idrive
Faudio
5
--
--
mA
mA
kHz
5
--
--
0.5
--
1.0
2. RX-2B (VDD=4.0V,Fosc=128KHz, Tamb=25°C, unless otherwise specified.)
c ha ra c te ristic
Operating Voltage
Symbol
VDD
Min
1.5
--
Typ
4.0
--
Ma x
5.0
3.0
--
Unit
V
Operating Current
IDD
mA
mA
mA
%
O/P Driving Current
Idrive
1
--
O/P Sinking Current
Isink
1
--
--
Effect Decoding Frequency Variation
Ftolerance
-20
--
20
PIN DESCRIPTION
1. TX-2B
Pin No.
Symbol
RIGHT
De sc ription
1
2
3
4
5
The rightward function will be selected, if this pin is connected to GND
This pin is used for testing mode
TEST
GND
Negative power supply
BACKWARD
FORWARD
The backward function will be selected, if this pin is connected to GND
The forward function will be selected, if this pin is connected to GND
(To be continued)
HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD
Rev: 1.0
2002.03.29
3
SILAN [ SILAN MICROELECTRONICS JOINT-STOCK ]
