Silan
Semiconductorsꢀ
SC9302 Series
ꢀ
CHIP TOPOGRAPHY
20
19
18
17
16
21
22
15
14
23
24
1
13
12
11
10
9
2
3
7
8
6
4
5
Chip size: 1.90 x 1.73 mm2
PAD COORDINATES
(Unit: µm)
Pad No.
Symbol
P1
X
Y
Pad No.
13
Symbol
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
X
Y
1
2
-934.05
-956.65
956.65
-668.20
-391.80
-137.60
589.50
846.10
899.15
954.35
927.70
927.70
-225.30
-503.00
-800.20
-879.95
-879.95
-861.45
-845.65
-847.35
-469.80
-283.90
-117.95
71.75
927.70
927.70
890.75
937.55
761.90
363.20
35.90
234.85
463.25
619.10
839.50
875.45
875.45
873.65
873.35
779.70
521.30
244.90
-5.70
P2
14
3
P3
15
4
P4
16
5
P5
17
6
P6
18
7
P7
19
8
P8
20
-679.90
-956.65
-956.65
-956.65
-940.35
9
P9
21
10
11
12
P10
P11
P12
22
23
24
Note: The original point of the coordinate is the die center.
HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD
Rev: 2.0
ꢀ
2001-11-01ꢀ
37
SILAN [ SILAN MICROELECTRONICS JOINT-STOCK ]
