EFM32G Data Sheet
Electrical Characteristics
4. Electrical Characteristics
4.1 Test Conditions
4.1.1 Typical Values
The typical data are based on TAMB=25°C and VDD=3.0 V, as defined in Table 4.2 General Operating Conditions on page 29, unless
otherwise specified.
4.1.2 Minimum and Maximum Values
The minimum and maximum values represent the worst conditions of ambient temperature, supply voltage and frequencies, as defined
in Table 4.2 General Operating Conditions on page 29, unless otherwise specified.
4.2 Absolute Maximum Ratings
The absolute maximum ratings are stress ratings, and functional operation under such conditions are not guaranteed. Stress beyond
the limits specified in the following table may affect the device reliability or cause permanent damage to the device. Functional operat-
ing conditions are given in Table 4.2 General Operating Conditions on page 29.
Table 4.1. Absolute Maximum Ratings
Parameter
Symbol
TSTG
TS
Test Condition
Min
-40
—
Typ
—
Max
150
260
Unit
°C
Storage temperature range
Maximum soldering temperature
Latest IPC/JEDEC J-
STD-020 Standard
—
°C
External main supply voltage
Voltage on any I/O pin
VDDMAX
0
-0.3
—
—
—
—
—
3.8
VDD+0.3
100
V
V
VIOPIN
Current per I/O pin (sink)
Current per I/O pin (source)
IIOMAX_SINK
IIOMAX_SOURCE
mA
mA
—
-100
4.3 General Operating Conditions
Table 4.2. General Operating Conditions
Parameter
Symbol
TAMB
VDDOP
fAPB
Min
-40
1.98
—
Typ
—
Max
85
Unit
Ambient temperature range
Operating supply voltage
Internal APB clock frequency
Internal AHB clock frequency
°C
V
—
3.8
32
—
MHz
MHz
fAHB
—
—
32
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