C8051F50x-F51x
Figure 4.2. QFP-48 Landing Diagram
Table 4.2. QFP-48 Landing Diagram Dimensions
Dimension
Min
8.30
8.30
Max
8.40
8.40
Dimension
Min
0.20
1.40
Max
0.30
1.50
C1
X1
C2
E
Y1
0.50 BSC
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the
metal pad is to be 60m minimum, all the way around the pad.
Stencil Design
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
good solder paste release.
5. The stencil thickness should be 0.125mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
Card Assembly
7. A No-Clean, Type-3 solder paste is recommended.
8. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.
Rev. 1.1
31
SILICON [ SILICON ]
