C8051F360/1/2/3/4/5/6/7/8/9
Table of Contents
1. System Overview.................................................................................................... 18
1.1. CIP-51™ Microcontroller Core.......................................................................... 22
1.1.1. Fully 8051 Compatible.............................................................................. 22
1.1.2. Improved Throughput............................................................................... 22
1.1.3. Additional Features .................................................................................. 23
1.2. On-Chip Memory............................................................................................... 24
1.3. On-Chip Debug Circuitry................................................................................... 24
1.4. Programmable Digital I/O and Crossbar........................................................... 25
1.5. Serial Ports ....................................................................................................... 26
1.6. Programmable Counter Array........................................................................... 26
1.7. 10-Bit Analog to Digital Converter..................................................................... 27
1.8. Comparators ..................................................................................................... 28
1.9. 10-bit Current Output DAC................................................................................ 30
2. Absolute Maximum Ratings .................................................................................. 32
3. Global Electrical Characteristics .......................................................................... 33
4. Pinout and Package Definitions............................................................................ 36
5. 10-Bit ADC (ADC0, C8051F360/1/2/6/7/8/9)........................................................... 47
5.1. Analog Multiplexer ............................................................................................ 48
5.2. Temperature Sensor......................................................................................... 49
5.3. Modes of Operation .......................................................................................... 51
5.3.1. Starting a Conversion............................................................................... 51
5.3.2. Tracking Modes........................................................................................ 52
5.3.3. Settling Time Requirements..................................................................... 53
5.4. Programmable Window Detector...................................................................... 58
5.4.1. Window Detector In Single-Ended Mode ................................................. 60
5.4.2. Window Detector In Differential Mode...................................................... 61
6. 10-Bit Current Mode DAC (IDA0, C8051F360/1/2/6/7/8/9).................................... 63
6.1. IDA0 Output Scheduling ................................................................................... 63
6.1.1. Update Output On-Demand ..................................................................... 63
6.1.2. Update Output Based on Timer Overflow ................................................ 64
6.1.3. Update Output Based on CNVSTR Edge................................................. 64
6.2. IDAC Output Mapping....................................................................................... 64
7. Voltage Reference (C8051F360/1/2/6/7/8/9).......................................................... 67
8. Comparators ........................................................................................................... 70
9. CIP-51 Microcontroller .......................................................................................... 80
9.1. Performance ..................................................................................................... 80
9.2. Programming and Debugging Support ............................................................. 81
9.3. Instruction Set................................................................................................... 82
9.3.1. Instruction and CPU Timing ..................................................................... 82
9.3.2. MOVX Instruction and Program Memory ................................................. 82
9.4. Memory Organization........................................................................................ 86
9.4.1. Program Memory...................................................................................... 86
9.4.2. Data Memory............................................................................................ 87
Rev. 1.0
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SILICON [ SILICON ]
