Si510/511
17. PCB Land Pattern: 2.5 x 3.2 mm, 6-pin
Figure 15 illustrates the 2.5 x 3.2 mm PCB land pattern for the Si510/511. Table 25 lists the values for the
dimensions shown in the illustration.
Figure 15. Si510/511 Recommended PCB Land Pattern
Table 25. PCB Land Pattern Dimensions (mm)
Dimension
(mm)
C1
1.9
E
2.50
0.70
1.05
X1
Y1
Notes:
General
3. All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
4. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
Stencil Design
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be
used to assure good solder paste release.
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
Card Assembly
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification
for Small Body Components.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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Rev. 1.4 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 29, 2021